Application: | Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Switch Baseplate |
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Type: | Solid |
Chemistry: | Inorganic Insulation |
Material: | Paper |
Thermal Rating: | H 180 |
Maximum Voltage: | <10KV |
Customization: |
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No. | Properties | Unit | Values | |||||
1 | Nominal Thickness | mm | 0.15 | 0.17 | 0.20 | 0.25 | 0.30 | 0.33 |
2 | Thickness Tolerance | mm | ±0.02 | ±0.03 | ±0.04 | ±0.05 | ||
3 | breakdown voltage ( No Bending) ≥ |
kv | 8 | 9 | 10 | |||
4 | Bond Strength At Room Temp. |
- | No delamination | |||||
5 | Bond Strength At (200±2)°C, 10 min |
- | No delamination, No blister, No adhesive flow |
Properties | Units | Values | ||||||||||
Nominal thickness | mm | 0.15 | 0.17 | 0.20 | 0.23 | 0.25 | 0.30 | 0.33 | ||||
Thickness tolerance | mm | ±0.02 | ±0.02 | ±0.03 | ±0.03 | ±0.04 | ±0.04 | ±0.05 | ||||
Grammage | g/m2 | 155±25 | 175±25 | 195±30 | 230±35 | 260±40 | 300±45 | 330±50 | ||||
Film thickness | mm | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | ||||
Tensile strength | MD | No bending | N/10 mm | ≥120 | ≥140 | ≥160 | ≥180 | ≥200 | ≥250 | ≥270 | ||
After bending | ≥70 | ≥90 | ≥90 | ≥130 | ≥150 | ≥170 | ≥180 | |||||
TD | No bending | ≥80 | ≥90 | ≥100 | ≥110 | ≥120 | ≥150 | ≥170 | ||||
After bending | ≥50 | ≥70 | ≥80 | ≥80 | ≥100 | ≥110 | ≥130 | |||||
Elongation | No bending | % | ≥10 | |||||||||
After bending | ≥8 | |||||||||||
Breakdown voltage | No bending | kV | ≥8 | ≥9 | ≥10 | |||||||
After bending | ≥7 | ≥8 | ≥9 | |||||||||
Bonding property at room temp. | No delamination | |||||||||||
Bonding property at 200 + 2 C, 10 min. | No Delamination, no bubble, no adhesive flow | |||||||||||
The quality warranty period | Twelve months | |||||||||||
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